ISBN: 9781441909848
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packagin… mais…
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ISBN: 9781441909848
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packagin… mais…
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2009, ISBN: 9781441909848
eBooks, eBook Download (PDF), 2010, RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing … mais…
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2009, ISBN: 9781441909848
Editor: Kuang, Ken, Editor: Kim, Franklin, Editor: Cahill, Sean S. Springer, Kindle Edition, Auflage: 2010, 492 Seiten, Publiziert: 2009-12-01T00:00:00.000Z, Produktgruppe: Digital Ebook … mais…
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2009, ISBN: 9781441909848
eBooks, eBook Download (PDF), 2010, [PU: Springer US], Springer US, 2009
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ISBN: 9781441909848
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packagin… mais…
no/na Orellfuessli.ch
ISBN: 9781441909848
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packagin… mais…
2009
ISBN: 9781441909848
eBooks, eBook Download (PDF), 2010, RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing … mais…
no/na amazon.com
2009, ISBN: 9781441909848
Editor: Kuang, Ken, Editor: Kim, Franklin, Editor: Cahill, Sean S. Springer, Kindle Edition, Auflage: 2010, 492 Seiten, Publiziert: 2009-12-01T00:00:00.000Z, Produktgruppe: Digital Ebook … mais…
Dados bibliográficos do melhor livro correspondente
| Autor: | |
| Título: | |
| Número ISBN: |
Dados detalhados do livro - RF and Microwave Microelectronics Packaging
EAN (ISBN-13): 9781441909848
ISBN (ISBN-10): 1441909842
Ano de publicação: 2009
Editor/Editora: Springer
285 Páginas
Língua: eng/Englisch
Livro na base de dados desde 2010-05-22T00:59:03+01:00 (Lisbon)
Página de detalhes modificada pela última vez em 2023-06-25T13:40:54+01:00 (Lisbon)
Número ISBN/EAN: 1441909842
Número ISBN - Ortografia alternativa:
1-4419-0984-2, 978-1-4419-0984-8
Ortografia alternativa e termos de pesquisa relacionados:
Autor do livro: cahill, kuang
Título do livro: self packaging, microwave for one, microelectronics
Dados da editora
Autor: Ken Kuang; Franklin Kim; Sean S. Cahill
Título: RF and Microwave Microelectronics Packaging
Editora: Springer; Springer US
285 Páginas
Ano de publicação: 2009-12-01
New York; NY; US
Língua: Inglês
149,79 € (DE)
154,00 € (AT)
177,00 CHF (CH)
Available
XVI, 285 p.
EA; E107; eBook; Nonbooks, PBS / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik; Elektronik; Verstehen; 3D packaging; RF and microwave microelectronics; composite material; electronic packaging; electronics; high-frequency electronics; material; packaging and processing methods; simulation; thermal management; thermal mechanical designs; C; Electronics and Microelectronics, Instrumentation; Microwaves, RF Engineering and Optical Communications; Electronic Circuits and Systems; Engineering; Schaltkreise und Komponenten (Bauteile); BB
Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies.- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages.- Polymeric Microelectromechanical Millimeter Wave Systems.- Millimeter-Wave Chip-on-Board Integration and Packaging.- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules.- RF/Microwave Substrate Packaging Roadmap for Portable Devices.- Ceramic Systems in Package for RF and Microwave.- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications.- LTCC Substrates for RF/MW Application.- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging.- High Performance Microelectronics Packaging Heat Sink Materials.- Technology Research on AlN 3D MCM.Presents methods and techniques used for measuring and testing of the electronic materials properties Presents an in-depth discussion of ceramic materials for RF/MW packaging Presents numerical simulation methods and techniques used in analysis of electronic devices and materials Discusses thermal management issues for RF/MW packaging Presents a RF/Microwave Packaging Roadmap for Portable Devices Includes supplementary material: sn.pub/extras
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