1996, ISBN: 9780387945347
Springer, Hardcover, Auflage: 1996, 168 Seiten, Publiziert: 1996-01-01T00:00:01Z, Produktgruppe: Book, 0.44 kg, Verkaufsrang: 4797983, Civil & Environmental, Engineering & Transportation,… mais…
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1995, ISBN: 9780387945347
Springer, Gebundene Ausgabe, Auflage: 1996, 184 Seiten, Publiziert: 1995-12-15T00:00:01Z, Produktgruppe: Buch, Luft- & Raumfahrttechnik, Ingenieurwissenschaften, Fachbücher, Kategorien, B… mais…
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1995, ISBN: 0387945342
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ISBN: 0387945342
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1996, ISBN: 9780387945347
Hardcover, Neubuch, VIB, [PU: Springer]
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1996, ISBN: 9780387945347
Springer, Hardcover, Auflage: 1996, 168 Seiten, Publiziert: 1996-01-01T00:00:01Z, Produktgruppe: Book, 0.44 kg, Verkaufsrang: 4797983, Civil & Environmental, Engineering & Transportation,… mais…
Madhusudana, C.V.:
Thermal Contact Conductance (Mechanical Engineering Series) - encadernado, livro de bolso1995, ISBN: 9780387945347
Springer, Gebundene Ausgabe, Auflage: 1996, 184 Seiten, Publiziert: 1995-12-15T00:00:01Z, Produktgruppe: Buch, Luft- & Raumfahrttechnik, Ingenieurwissenschaften, Fachbücher, Kategorien, B… mais…
1995
ISBN: 0387945342
[EAN: 9780387945347], Gebraucht, sehr guter Zustand, [PU: Springer], ENGINEERING THERMODYNAMICS, Lightly used, if at all. NO markings. Pasadena's finest new and used bookstore., Books
ISBN: 0387945342
[EAN: 9780387945347], Neubuch, [PU: Springer]
1996, ISBN: 9780387945347
Hardcover, Neubuch, VIB, [PU: Springer]
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Dados detalhados do livro - Thermal Contact Conductance (Mechanical Engineering Series)
EAN (ISBN-13): 9780387945347
ISBN (ISBN-10): 0387945342
Livro de capa dura
Ano de publicação: 1996
Editor/Editora: Springer
188 Páginas
Peso: 0,450 kg
Língua: eng/Englisch
Livro na base de dados desde 2007-04-24T19:53:43+01:00 (Lisbon)
Página de detalhes modificada pela última vez em 2022-06-04T11:35:49+01:00 (Lisbon)
Número ISBN/EAN: 9780387945347
Número ISBN - Ortografia alternativa:
0-387-94534-2, 978-0-387-94534-7
Ortografia alternativa e termos de pesquisa relacionados:
Título do livro: telos, contact
Dados da editora
Autor: C.V. Madhusudana
Título: Mechanical Engineering Series; Thermal Contact Conductance
Editora: Springer; Springer US
168 Páginas
Ano de publicação: 1995-12-15
New York; NY; US
Peso: 0,970 kg
Língua: Inglês
91,97 € (DE)
94,55 € (AT)
132,63 CHF (CH)
Not available, publisher indicates OP
BB; Book; Hardcover, Softcover / Physik, Astronomie/Thermodynamik; Thermodynamik und Wärme; Verstehen; metals; material; mechanism; design; plasticity; flow; heat transfer; C; Thermodynamics; Engineering; BB; BC; EA
1 Introduction.- 1.1 Mechanism of Contact Heat Transfer.- 1.2 Significance of Contact Heat Transfer.- 1.3 Scope of Present Work.- References.- 2 Thermal Constriction Resistance.- 2.1 Circular Disc in Half Space.- 2.2 Resistance of a Constriction Bounded by a Semi-Infinite Cylinder.- 2.3 Constriction in a Fluid Environment.- 2.4 Other Types of Constrictions.- References.- 3 Solid Spot Thermal Conductance of a Joint.- 3.1 Multiple Spot Contact Conductance.- 3.2 Estimation of the Number and Average Size of Contact Spots.- 3.2.1 Gaussian Distribution of Heights and Slopes.- 3.3 Deformation Analysis.- 3.3.1 The Plasticity Index.- 3.3.2 Ratio of Real to Apparent Area of Contact.- 3.4 Theoretical Expressions for Thermal Contact Conductance.- 3.4.1 Solid Spot Conductance for Fully Plastic Deformation.- 3.4.2 Solid Spot Conductance for Elastic Deformation.- 3.5 Effect of Macroscopic Irregularities.- 3.6 Correlations for Solid Spot Conductance.- 3.7 Numerical Example: Solid Spot Conductance.- References.- 4 Gas Gap Conductance.- 4.1 Factors Affecting Gas Gap Conductance.- 4.2 The Accommodation Coefficient.- 4.2.1 Effect of Temperature on Accommodation Coefficient.- 4.2.2 Summary of Observations.- 4.3 Effect of Gas Pressure on Gas Gap Conductance.- 4.4 Correlations for Gas Gap Conductance.- 4.5 Gas Gap Conductance: Conclusions.- 4.6 Numerical Example: Gas Gap Conductance.- References.- 5 Experimental Aspects.- 5.1 Axial Heat Flow Apparatus.- 5.2 Radial Heat Flow Apparatus.- 5.3 Periodic Contacts.- 5.4 Transient Measurements.- 5.5 Analog Methods.- 5.6 Accuracy.- 5.7 Summary.- References.- 6 Control of Thermal Contact Conductance Using Interstitial Materials.- 6.1 Solid Interstitial Materials.- 6.2 Metallic Foils.- 6.3 Wire Screens.- 6.4 Surface Coatings.- 6.4.1 Constriction Resistance in a Plated Contact.- 6.4.2 Thermal Contact Conductance of Coated Surfaces.- 6.5 Insulating Interstitial Materials.- 6.6 Lubricating Films and Greases.- 6.7 Other Interstitial Materials.- References.- 7 Special Topics in Thermal Contact Conductance.- 7.1 Bolted or Riveted Joints.- 7.1.1 Stress Distribution at the Bolted Joint Interface.- 7.1.2 Heat Transfer in Bolted Joints.- 7.1.3 Summary.- 7.2 Cylindrical Joints.- 7.3 Rectification.- 7.3.1 Rectification at Moderate to High Contact Pressures.- 7.3.2 Specimens with Spherical Caps.- 7.3.3 Plane Ended Specimens.- 7.3.4 Microscopic Resistance.- 7.3.5 Rectification at Low Contact Pressures.- 7.3.6 Summary.- 7.4 Hysteresis.- 7.5 Effective Thermal Conductivity of Packed Beds.- 7.6 Stacks of Laminations.- 7.7 Solid Spot Conductance of Specific Materials.- 7.7.1 Stainless Steel and Aluminum.- 7.7.2 Zircaloy-2/Uranium Dioxide Interfaces.- 7.7.3 Porous Materials.- 7.8 Thermal Contact Resistance in the Presence of Oxide Films.- References.- 8 Concluding Remarks.- 8.1 Control of Thermal Contact Conductance.- 8.1.1 Bare Metallic Junctions.- 8.1.2 Use of Interstitial Materials.- 8.1.3 Load Cycling.- 8.1.4 Heat Flow Direction.- 8.1.5 Stacks of Laminations.- 8.2 Recommendations for Further Research.- References.- Author Index.Outros livros adicionais, que poderiam ser muito similares com este livro:
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