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Advanced Packaging For Microelectronic and Microsystem Applications: With Emphasis on GaN Technology - Anderson, Travis
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Anderson, Travis:

Advanced Packaging For Microelectronic and Microsystem Applications: With Emphasis on GaN Technology - Livro de bolso

2008, ISBN: 9783639096767

VDM Verlag Dr. Müller, Taschenbuch, 116 Seiten, Publiziert: 2008-11-26T00:00:01Z, Produktgruppe: Buch, 0.37 kg, Elektrotechnik, Ingenieurwissenschaft & Technik, Naturwissenschaften & Tech… mais…

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Advanced Packaging For Microelectronic and Microsystem Applications: With Emphasis on GaN Technology - Anderson, Travis
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Anderson, Travis:

Advanced Packaging For Microelectronic and Microsystem Applications: With Emphasis on GaN Technology - Livro de bolso

2008, ISBN: 9783639096767

VDM Verlag Dr. Müller, Taschenbuch, 116 Seiten, Publiziert: 2008-11-26T00:00:01Z, Produktgruppe: Buch, 0.37 kg, Elektrotechnik, Ingenieurwissenschaft & Technik, Naturwissenschaften & Tech… mais…

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Advanced Packaging For Microelectronic and Microsystem Applications - Travis Anderson
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Travis Anderson:
Advanced Packaging For Microelectronic and Microsystem Applications - Livro de bolso

ISBN: 9783639096767

*Advanced Packaging For Microelectronic and Microsystem Applications* - With Emphasis on GaN Technology / Taschenbuch für 48.99 € / Aus dem Bereich: Bücher, Wissenschaft, Technik Medien >… mais…

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Advanced Packaging For Microelectronic and Microsystem Applications - Travis Anderson
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Travis Anderson:
Advanced Packaging For Microelectronic and Microsystem Applications - Livro de bolso

ISBN: 9783639096767

Advanced Packaging For Microelectronic and Microsystem Applications ab 48.99 € als Taschenbuch: With Emphasis on GaN Technology. Aus dem Bereich: Bücher, Wissenschaft, Technik, Medien > B… mais…

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Advanced Packaging For Microelectronic and Microsystem Applications - Travis Anderson
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Travis Anderson:
Advanced Packaging For Microelectronic and Microsystem Applications - Livro de bolso

ISBN: 9783639096767

Advanced Packaging For Microelectronic and Microsystem Applications ab 48.99 € als Taschenbuch: With Emphasis on GaN Technology. Aus dem Bereich: Bücher, Wissenschaft, Technik, Medien > B… mais…

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Advanced Packaging For Microelectronic and Microsystem Applications

The emergence of GaN-based devices promises a revolution in areas requiring high performance electronics, such as high speed earth and space-based communication systems, advanced radar, integrated sensors, high temperature electronics, and utility power switching. The properties of this system make it ideally suited for operation at elevated temperatures and at voltage and current levels well beyond that accessible by Si. Recent improvements in material quality and device performance are rapidly opening the door to commercialization, and III-N technologies are demonstrating exciting developments of late. Though devices are entering commercialization, there are still considerable unknowns, particularly in the reliability field. Recent advances at the University of Florida will be detailed in this work.

Dados detalhados do livro - Advanced Packaging For Microelectronic and Microsystem Applications


EAN (ISBN-13): 9783639096767
ISBN (ISBN-10): 3639096762
Livro de capa dura
Livro de bolso
Ano de publicação: 2008
Editor/Editora: VDM Verlag Dr. Müller
116 Páginas
Peso: 0,189 kg
Língua: ger/Deutsch

Livro na base de dados desde 2007-12-15T14:49:21+00:00 (Lisbon)
Página de detalhes modificada pela última vez em 2023-09-15T18:27:46+01:00 (Lisbon)
Número ISBN/EAN: 9783639096767

Número ISBN - Ortografia alternativa:
3-639-09676-2, 978-3-639-09676-7
Ortografia alternativa e termos de pesquisa relacionados:
Autor do livro: anderson, travis
Título do livro: advanced packaging, applications


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