2011, ISBN: 3709174309
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2011, ISBN: 3709174309
[EAN: 9783709174302], Neubuch, [SC: 0.0], [PU: Springer Vienna], SEMICONDUCTORDEVICES; 3DGRAPHICS; RSI; ALGORITHMS, Druck auf Anfrage Neuware - Printed after ordering - Whereas two-dimens… mais…
2011, ISBN: 3709174309
[EAN: 9783709174302], Neubuch, [PU: Springer Vienna], 3DGRAPHICS RSI ALGORITHMS SEMICONDUCTORDEVICES INFORMATIK EDV ANWENDUNGS-SOFTWARE 3D GRAPHICS SEMICONDUCTOR DEVICES SIMULATION COMPUT… mais…
2011
ISBN: 3709174309
Softcover reprint of the original 1st ed. 1995 Kartoniert / Broschiert Industrielle Chemie und Chemietechnologie, Elektronik, Computer-Aided Design (CAD), Computermodellierung und -simu… mais…
2011, ISBN: 3709174309
[EAN: 9783709174302], Neubuch, [PU: Springer], New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000., Books
2011, ISBN: 3709174309
[EAN: 9783709174302], Neubuch, [PU: Springer], Books
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Dados detalhados do livro - 3-Dimensional Process Simulation
EAN (ISBN-13): 9783709174302
ISBN (ISBN-10): 3709174309
Livro de bolso
Ano de publicação: 2011
Editor/Editora: Springer Vienna
Livro na base de dados desde 2014-10-10T09:08:08+01:00 (Lisbon)
Página de detalhes modificada pela última vez em 2024-03-19T16:55:20+00:00 (Lisbon)
Número ISBN/EAN: 9783709174302
Número ISBN - Ortografia alternativa:
3-7091-7430-9, 978-3-7091-7430-2
Ortografia alternativa e termos de pesquisa relacionados:
Autor do livro: iny lorenz
Título do livro: the process, simulation
Dados da editora
Autor: J. Lorenz
Título: 3-Dimensional Process Simulation
Editora: Springer; Springer Wien
196 Páginas
Ano de publicação: 2011-10-06
Vienna; AT
Impresso / Feito em
Peso: 0,375 kg
Língua: Inglês
53,49 € (DE)
54,99 € (AT)
59,00 CHF (CH)
POD
VIII, 196 p.
BC; Simulation and Modeling; Hardcover, Softcover / Informatik, EDV/Anwendungs-Software; Computermodellierung und -simulation; Verstehen; 3D graphics; RSI; algorithms; semiconductor devices; simulation; Industrial Chemistry/Chemical Engineering; Condensed Matter Physics; Electronics and Microelectronics, Instrumentation; Computer-Aided Engineering (CAD, CAE) and Design; Computer Modelling; Industrial Chemistry; Condensed Matter Physics; Electronics and Microelectronics, Instrumentation; Computer-Aided Engineering (CAD, CAE) and Design; Industrielle Chemie und Chemietechnologie; Physik der kondensierten Materie (Flüssigkeits- und Festkörperphysik); Elektronik; Computer-Aided Design (CAD); BB
Three-Dimensional Topography Simulator: 3D-MULSS and Its Applications.- A Three-Dimensional Process Simulation using Advanced SMART-P program.- 3-D Topography Simulation Using Surface Representation and Central Utilities.- Three Dimensional Simulation of Thermal Processes.- 3D Process Simulation at IEMN/ISEN.- 3D Simulation of Topography and Doping Processes at FhG.- 3D TCAD at TU Vienna.- Multi-Dimensional TCAD: The PROMPT/DESSIS Approach.- 3D Process Simulation Requirements And Tradeoffs From Industrial Perspective.- Author Index.Outros livros adicionais, que poderiam ser muito similares com este livro:
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