ISBN: 9781441909831
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packagin… mais…
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2009, ISBN: 9781441909831
Editor: Kuang, Ken, Editor: Kim, Franklin, Editor: Cahill, Sean S. Springer, Hardcover, Auflage: 2010, 301 Seiten, Publiziert: 2009-11-17T00:00:01Z, Produktgruppe: Book, 1.33 kg, Books Gl… mais…
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ISBN: 9781441909831
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ISBN: 9781441909831
Springer. hardcover. New. 6x0x9. Brand New Book in Publishers original Sealing, Springer, 6
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2009, ISBN: 1441909834
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ISBN: 9781441909831
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packagin… mais…
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2009, ISBN: 9781441909831
Editor: Kuang, Ken, Editor: Kim, Franklin, Editor: Cahill, Sean S. Springer, Hardcover, Auflage: 2010, 301 Seiten, Publiziert: 2009-11-17T00:00:01Z, Produktgruppe: Book, 1.33 kg, Books Gl… mais…
ISBN: 9781441909831
Hardback, [PU: Springer-Verlag New York Inc.], RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to … mais…
no/na Biblio.co.uk
ISBN: 9781441909831
Springer. hardcover. New. 6x0x9. Brand New Book in Publishers original Sealing, Springer, 6
no/na AbeBooks.com
2009, ISBN: 1441909834
[EAN: 9781441909831], New book, [PU: Springer], Clean and crisp and new!, Books
Dados bibliográficos do melhor livro correspondente
| Autor: | |
| Título: | |
| Número ISBN: |
Dados detalhados do livro - RF and Microwave Microelectronics Packaging
EAN (ISBN-13): 9781441909831
ISBN (ISBN-10): 1441909834
Livro de capa dura
Ano de publicação: 2009
Editor/Editora: Springer
285 Páginas
Peso: 0,635 kg
Língua: eng/Englisch
Livro na base de dados desde 2007-08-09T01:08:01+01:00 (Lisbon)
Página de detalhes modificada pela última vez em 2023-07-29T14:36:34+01:00 (Lisbon)
Número ISBN/EAN: 1441909834
Número ISBN - Ortografia alternativa:
1-4419-0983-4, 978-1-4419-0983-1
Ortografia alternativa e termos de pesquisa relacionados:
Autor do livro: cahill, franklin, kim, kuang
Título do livro: self packaging, microwave for one, microelectronics
Dados da editora
Autor: Ken Kuang; Franklin Kim; Sean S. Cahill
Título: RF and Microwave Microelectronics Packaging
Editora: Springer; Springer US
285 Páginas
Ano de publicação: 2009-11-17
New York; NY; US
Impresso / Feito em
Língua: Inglês
160,49 € (DE)
164,99 € (AT)
177,00 CHF (CH)
POD
XVI, 285 p.
BB; Hardcover, Softcover / Technik/Elektronik, Elektrotechnik, Nachrichtentechnik; Elektronik; Verstehen; 3D packaging; RF and microwave microelectronics; composite material; electronic packaging; electronics; high-frequency electronics; material; packaging and processing methods; simulation; thermal management; thermal mechanical designs; Electronics and Microelectronics, Instrumentation; Microwaves, RF Engineering and Optical Communications; Electronic Circuits and Systems; Schaltkreise und Komponenten (Bauteile); EA; BC
Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies.- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages.- Polymeric Microelectromechanical Millimeter Wave Systems.- Millimeter-Wave Chip-on-Board Integration and Packaging.- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules.- RF/Microwave Substrate Packaging Roadmap for Portable Devices.- Ceramic Systems in Package for RF and Microwave.- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications.- LTCC Substrates for RF/MW Application.- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging.- High Performance Microelectronics Packaging Heat Sink Materials.- Technology Research on AlN 3D MCM.Presents methods and techniques used for measuring and testing of the electronic materials properties Presents an in-depth discussion of ceramic materials for RF/MW packaging Presents numerical simulation methods and techniques used in analysis of electronic devices and materials Discusses thermal management issues for RF/MW packaging Presents a RF/Microwave Packaging Roadmap for Portable Devices Includes supplementary material: sn.pub/extras
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