2010, ISBN: 1441909613
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2010, ISBN: 1441909613
[EAN: 9781441909619], New book, [PU: Springer], Books
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2010, ISBN: 1441909613
[EAN: 9781441909619], Neubuch, [SC: 0.0], [PU: Springer Nature Singapore], COMPUTERS - GENERAL INFORMATION; / CAD-CAM; ARCHITECTURE METHODS & MATERIALS; TECHNOLOGY ENGINEERING CONSTRUCTIO… mais…
2015, ISBN: 9781441909619
[ED: Buch], [PU: Springer New York], Neuware - Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more funct… mais…
ISBN: 9781441909619
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneo… mais…
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ISBN: 9781441909619
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2010, ISBN: 1441909613
[EAN: 9781441909619], New book, [PU: Springer], Books
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Dados detalhados do livro - Three Dimensional System Integration: IC Stacking Process and Design
EAN (ISBN-13): 9781441909619
ISBN (ISBN-10): 1441909613
Livro de capa dura
Livro de bolso
Ano de publicação: 2010
Editor/Editora: Springer
246 Páginas
Peso: 0,527 kg
Língua: eng/Englisch
Livro na base de dados desde 2008-04-22T14:15:08+01:00 (Lisbon)
Página de detalhes modificada pela última vez em 2024-04-05T10:40:27+01:00 (Lisbon)
Número ISBN/EAN: 9781441909619
Número ISBN - Ortografia alternativa:
1-4419-0961-3, 978-1-4419-0961-9
Ortografia alternativa e termos de pesquisa relacionados:
Autor do livro: papanikolaou, rado, papan, radojcic, riko
Título do livro: three dimensional design, integration, whole system design, process design
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