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Chemical-Mechanical Planarization of Semiconductor Materials: 69 (Springer Series in Materials Science, 69)
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Chemical-Mechanical Planarization of Semiconductor Materials: 69 (Springer Series in Materials Science, 69) - Livro de bolso

2010, ISBN: 9783642077388

Editor: Oliver, M.R. Springer, Paperback, Auflage: Softcover reprint of hardcover 1st ed. 2004, 439 Seiten, Publiziert: 2010-12-01T00:00:01Z, Produktgruppe: Book, Hersteller-Nr.: 298 blac… mais…

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Chemical-Mechanical Planarization of Semiconductor Materials (Springer Series in Materials Science, 69, Band 69) - Livro de bolso

2010, ISBN: 9783642077388

Springer Berlin Heidelberg, Taschenbuch, Auflage: Softcover reprint of hardcover 1st ed. 2004, 440 Seiten, Publiziert: 2010-02-19T00:00:01Z, Produktgruppe: Buch, Hersteller-Nr.: 298 black… mais…

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Chemical-Mechanical Planarization of Semiconductor Materials (Springer Series in Materials Science, 69, Band 69) - Livro de bolso

2010

ISBN: 9783642077388

Springer Berlin Heidelberg, Taschenbuch, Auflage: Softcover reprint of hardcover 1st ed. 2004, 440 Seiten, Publiziert: 2010-02-19T00:00:01Z, Produktgruppe: Buch, Hersteller-Nr.: 298 black… mais…

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Chemical-Mechanical Planarization of Semiconductor Materials - Oliver, M. R. (Herausgeber)
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Oliver, M. R. (Herausgeber):
Chemical-Mechanical Planarization of Semiconductor Materials - Livro de bolso

2010, ISBN: 3642077382

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Softcover reprint of hardcover 1st ed. 2004 Kartoniert / Broschiert Physikalische Chemie, Materialwissenschaft, Werkstoffprüfung, Fertigungstechnik und Ingenieurwesen, Elektronik, diele… mais…

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ISBN: 9783642077388

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Chemical-Mechanical Planarization of Semiconductor Materials: 69 (Springer Series in Materials Science, 69)
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Número ISBN:

9783642077388


This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Dados detalhados do livro - Chemical-Mechanical Planarization of Semiconductor Materials: 69 (Springer Series in Materials Science, 69)


EAN (ISBN-13): 9783642077388
ISBN (ISBN-10): 3642077382
Livro de capa dura
Livro de bolso
Ano de publicação: 2010
Editor/Editora: Springer

Livro na base de dados desde 2014-10-10T07:23:08+01:00 (Lisbon)
Página de detalhes modificada pela última vez em 2023-11-03T21:27:35+00:00 (Lisbon)
Número ISBN/EAN: 9783642077388

Número ISBN - Ortografia alternativa:
3-642-07738-2, 978-3-642-07738-8
Ortografia alternativa e termos de pesquisa relacionados:
Título do livro: mechanical materials, mechanica

Dados da editora

Autor: M.R. Oliver
Título: Springer Series in Materials Science; Chemical-Mechanical Planarization of Semiconductor Materials
Editora: Springer; Springer Berlin
428 Páginas
Ano de publicação: 2010-12-01
Berlin; Heidelberg; DE
Impresso / Feito em
Língua: Inglês
213,99 € (DE)
219,99 € (AT)
236,00 CHF (CH)
POD
XI, 428 p.

BC; Hardcover, Softcover / Technik/Maschinenbau, Fertigungstechnik; Werkstoffprüfung; Verstehen; dielectrics; material; metals; reactions; semiconductor; semiconductor technology; Characterization and Analytical Technique; Electronics and Microelectronics, Instrumentation; Machines, Tools, Processes; Physical Chemistry; Surfaces, Interfaces and Thin Film; Optical Materials; Elektronik; Fertigungstechnik und Ingenieurwesen; Physikalische Chemie; Materialwissenschaft; Technische Anwendung von elektronischen, magnetischen, optischen Materialien; BB; EA

This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Comprehensive book covering the technology of CMP for all semiconductor related materials, as well as the science and modelling of the various mechanisms Includes supplementary material: sn.pub/extras

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