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Dual in-line package - Frederic P. Miller
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Frederic P. Miller:

Dual in-line package - Livro de bolso

ISBN: 6130233728

[EAN: 9786130233723], Neubuch, [PU: Alphascript Publishing], This item is printed on demand - it takes 3-4 days longer - Neuware -In microelectronics, a dual in-line package, sometimes ca… mais…

NEW BOOK. Custos de envio:Versandkostenfrei. (EUR 0.00) BuchWeltWeit Inh. Ludwig Meier e.K., Bergisch Gladbach, Germany [57449362] [Rating: 5 (von 5)]
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Dual in-line package / Frederic P. Miller (u. a.) / Taschenbuch / Englisch / Alphascript Publishing / EAN 9786130233723 - Miller, Frederic P.
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Miller, Frederic P.:

Dual in-line package / Frederic P. Miller (u. a.) / Taschenbuch / Englisch / Alphascript Publishing / EAN 9786130233723 - Livro de bolso

ISBN: 9786130233723

[ED: Taschenbuch], [PU: Alphascript Publishing], In microelectronics, a dual in-line package, sometimes called a DIL package, is an electronic device package with a rectangular housing an… mais…

Custos de envio:Versandkostenfrei, Versand nach Deutschland. (EUR 0.00) Buchbär
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Dual in-line package | Frederic P. Miller (u. a.) | Taschenbuch | Englisch | Alphascript Publishing | EAN 9786130233723 - Miller, Frederic P.
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Miller, Frederic P.:
Dual in-line package | Frederic P. Miller (u. a.) | Taschenbuch | Englisch | Alphascript Publishing | EAN 9786130233723 - Livro de bolso

ISBN: 9786130233723

[ED: Taschenbuch], [PU: Alphascript Publishing], In microelectronics, a dual in-line package, sometimes called a DIL package, is an electronic device package with a rectangular housing an… mais…

Custos de envio:Versandkostenfrei, Versand nach Deutschland. (EUR 0.00) preigu
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Dual in-line package
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Dual in-line package - novo libro

ISBN: 9786130233723

In microelectronics, a dual in-line package, sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins… mais…

  - Nr. URPLPB0M42N. Custos de envio:Versandkosten: 0 EUR, 11, zzgl. Versandkosten. (EUR 0.00)
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Dual in-line package
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Dual in-line package - encadernado, livro de bolso

2009, ISBN: 9786130233723

[ED: Kartoniert / Broschiert], [PU: Alphascript Publishing], Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. In microelectronics, a dual i… mais…

Custos de envio:Versandkostenfrei, Versand nach Deutschland. (EUR 0.00) Moluna GmbH

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Dual in-line package

In microelectronics, a dual in-line package, sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The pins are all parallel, point downward, and extend past the bottom plane of the package at least enough to be through-hole mounted to a printed circuit board, i.e. to pass through holes on the PCB and be soldered on the other side. DIP is also sometimes considered to stand for dual in-line pin, in which case the phrase 'DIP package' is non-redundant. Generally, a DIP is relatively broadly defined as any rectangular package with two uniformly spaced parallel rows of pins pointing downward, whether it contains an IC chip or some other device, and whether the pins emerge from the sides of the package and bend downwards or emerge directly from the bottom of the package and are completely straight. In more specific usage, the term refers only to an IC package of the former description A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14.

Dados detalhados do livro - Dual in-line package


EAN (ISBN-13): 9786130233723
ISBN (ISBN-10): 6130233728
Livro de capa dura
Livro de bolso
Ano de publicação: 2009
Editor/Editora: International Book Marketing Service Ltd

Livro na base de dados desde 2008-06-10T22:48:44+01:00 (Lisbon)
Página de detalhes modificada pela última vez em 2024-01-22T00:47:58+00:00 (Lisbon)
Número ISBN/EAN: 9786130233723

Número ISBN - Ortografia alternativa:
613-0-23372-8, 978-613-0-23372-3
Ortografia alternativa e termos de pesquisa relacionados:
Autor do livro: miller
Título do livro: package, dual, all line, microelectronics


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